ADLINK launches i.MX 95 modules for rugged edge intelligence
ADLINK has unveiled two new computing modules based on the NXP i.MX 95 Applications Processor, broadening its portfolio with devices aimed at sectors where edge intelligence and reliable processing are key.
Module platforms
The new offerings, designated as OSM-IMX95 and LEC-IMX95, are available in different form factors to address varied market requirements. Both rely on NXP's i.MX 95 processor, which combines up to six Arm Cortex-A55 cores with real-time Cortex-M7 and Cortex-M33 microcontrollers. Each also features the Neutron Neural Processing Unit, which supports up to 2 TOPS AI performance and is intended to handle advanced inference and analytics tasks at the edge.
Graphics and image handling are supported by an on-board Image Signal Processor, Video Processing Unit, and Arm Mali G310 GPU.
The modules accept up to 8GB of LPDDR4L memory and offer storage options up to 256GB eMMC, with interface support including DSI and LVDS alongside standard connectivity such as USB 2.0 and 3.0 ports and Ethernet with Precision Time Protocol.
OSM module
The OSM-IMX95 module is constructed on a compact 45 mm by 45 mm single-sided PCB. Its soldered-down design is intended for ruggedness and to simplify assembly, thus reducing costs and the risks of mechanical and thermal stress. The module's low power usage and soldered configuration suit embedded, space-limited, and high-volume manufacture, making it a candidate for applications in areas such as portable healthcare devices, smart city sensors, and compact industrial equipment.
Industrial reliability is supported by ruggedisation options, and the product's design aims to ensure durability in conditions where heat, vibration, or restricted space are issues. The integrated NPU is designed to enable developers to introduce high-performance AI into devices where conventional PCBs may not be suitable due to their physical or operational constraints.
SMARC module
The LEC-IMX95 is a SMARC 2.2-compliant module measuring 82 mm by 50 mm. It targets scalability, supporting a range of industrial and commercial IoT projects through an open standard format. The model includes an optional 10GbE interface, in addition to dual GbE, for networks requiring greater bandwidth.
Features such as secure boot and real-time control position the module for deployment in applications where data security and deterministic control are crucial, including retail automation, transportation, and smart infrastructure deployments. The modular approach facilitates both rapid prototyping and transition to deployment, with support for long-term availability to suit markets demanding stable supply for extended periods.
Customisation options
ADLINK provides both off-the-shelf modules and custom design services. Customers can select modules that offer modularity for easier future upgrades or compact, soldered-down versions for space-constrained use cases. Both platforms are supported by a stated product lifecycle of 15 years, targeting customers with long-term embedded requirements.
"It's not about the industry where you're in - it's about choosing the right form factor for your design goals: modular expandability for future-proof adaptability, or soldered resilience for space- and cost-constrained deployments. It's your call," said Tomasz Swatowski, Platform Marketing Dept, ADLINK Technology.
